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Electronics manufacturing worker in a clean suit inspecting an electronic chip
Electronics

Integrated Circuit Packaging, Assembly and Test

Leveraging our unique and innovative technologies that help you enhance competitiveness

The electronics packaging and assembly industry is constantly adjusting to satisfy the requirements of the newest generation of semiconductors. Smaller footprint device sizes, 2.5D and 3D TSV packaging are just some of the changes that have occurred.

With these changes come challenges to the manufacturing process, so how to use and control of nitrogen or hydrogen-based atmospheres is critical to achieve the best performance.

Air Products’ expertise, technologies and gas supply advantages can provide improved performance and up-time, while reducing defects and total cost of ownership for your integrated circuit board assembly and test processes.