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Activated Hydrogen for Fluxless Reflow for Wafer Level Packaging

Proprietary, patented innovation for wafer level packaging applications, including wafer bump and copper pillar reflow

Building on our 25 years of proprietary and patented innovation for the global electronics packaging industry, Air Products has developed the Electron Attachment (EA) technology, a novel flux-free soldering technology that uses activated hydrogen at ambient pressure with a starting temperature as low as 100° C to remove metal oxides from electroplated solder bumps on semiconductor wafers and permit reflow of these bumps to obtain the proper shape and size for interconnection onto a package or substrate.