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Hydrogen

Reflow Furnace

The function of the reflow furnace is to provide an evenly heated atmosphere to allow for the deposited solder paste to reflow (melt) and to allow for connection of the SMT components to the printed circuit board. Convective heating is the most widely used method to provide for this heated atmosphere. Air or nitrogen can be used; however nitrogen is preferred to achieve lower soldering defects.

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Hydrogen

Hydrogen is a reactive gas that is used to reduce the metal oxides in your process.

Hydrogen is a reactive gas that is used to reduce the metal oxides in your process.

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