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Argon

Flip Chip Assembly

Flip chip assembly allows for a direct or shorter signal path between the chip and the system. Flip chip assembly is accomplished by depositing solder bumps on the active surface of the chip, either in a peripheral (on the outer edge of the chip) array or an area array pattern (over the entire active surface of the chip). These solder bumps are then reflowed onto a package or printed circuit board. Assembly is accomplished in a reflow furnace using a nitrogen atmosphere and flux. Contact Air Products at 800-654-4567 to see how we can help you improve your reflow process.

Other Applications

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Product NameDescription/BenefitsDownloads

Argon

Argon can be used as an inerting atmosphere in place of nitrogen for specialised processes.

Argon can be used as an inerting atmosphere in place of nitrogen for specialised processes.

Services

Safety Audits

Site visit to inspect the use of process gases and to assess their proper use from an EH&S viewpoint. To provide safety suggestions to reduce risks in the process areas and supply systems.

Site visit to inspect the use of process gases and to assess their proper use from an EH&S viewpoint. To provide safety suggestions to reduce risks in the process areas and supply systems.

Test Programme

To evaluate the use of our atmospheres to determine the benefits to your processes.

To evaluate the use of our atmospheres to determine the benefits to your processes.

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