In test, the assembled printed circuit boards or integrated circuit packages are placed into a fixture that brings electrical power to the boards or packages to make them live, functioning boards or packages. This group of active boards or active packages is then placed into an EES chamber that will cycle between high and low temperature regimes for a number of cycles to determine if these stresses will initiate failures in the assembled boards or packages. These failures will be analysed for cause. Our industrial gases, technology, audits and optimisation studies can help you improve productivity in your facility. Please contact our engineering specialists at 800-654-4567 to find out more.